The unannounced Samsung Galaxy S7, which recently entered the rumour mills, is now being said to sport a magnesium alloy frame. The glass back panel would stay the same as seen with Galaxy S6 earlier this year, said a Weibo. The build is said to make the smartphone sturdier than before and carry a more premium feel.
As per My Drivers, (via Sammobile), the upcoming flagship handset would include the Sabre 9018AQ2M audio chip by ESS Technology, letting users listen to hi-fi grade audio. The chip is said to feature 129 dB signal-to-noise ratio and support PCM up to 32-bit and 384 KHz along with DSD 11.2 MHz sampling. The chip will take up 1mW in standby mode and not more than 40mW even in heavy usage. Samsung however, is yet to confirm any of the aforementioned features or the existence of the Galaxy S7 itself.
In addition, Samsung had been granted a patent for a pressure sensitive touch display technology, similar to Apple's 3D Touch feature. The patent revealed by Korean Intellectual Property Office describes how the device would throw different software results based on how hard the display is pressed. The pressure is said to be measured via different voltage levels. For instance, if users presses the key 'a', they would get a lowercase letter. However, pressing the key further would make the letter uppercase. The patent comes at the time when Samsung is said to use Synaptics' ClearForce pressure-sensitive touch solution for its next Galaxy smartphones, specifically, the Galaxy S7.
Earlier this week, a report said that Samsung would be unveiling the rumoured Galaxy S7 smartphone as soon as January next year. This however, contradicts the South Korean tech giant's traditional launch of flagship smartphones during the Mobile World Congress trade show, which usually takes place between late February and early March. Nothing can be confirmed for now.