Chinese website TechWeb claims that Motorola may employ a heat pipe for handling any possible heat issues with the Qualcomm Snapdragon 820 chipset anticipated to be used. In a leaked image, the heat pipe for cooling can be seen placed under the hood at the rear. The website claims that this is a prototype of the Moto X (Gen 4). The report cites supply chain sources adds that Motorola may unveil the handset only in second quarter of 2016.
If this comes out to be true, Motorola may follow the lead of Microsoft which added liquid cooling technology on the Lumia 950 XL to cool down the innards of the smartphone, including and especially the chipset components.
In another rumour, a tipster has claimed that Motorola's next-generation Moto X may pack a fingerprint scanner. Unfortunately, details about the feature are limited as of now. There is no word whether the fingerprint recognition technology will be employed at the rear or at the front - as seen in most smartphones.
Earlier, an image surfaced on the Internet claimed to be from the unannounced Motorola Moto X (Gen 4) rear panel. Notably, the smartphone seen in the leaked heat sink image appears to match that in the rear panel image.
To recall, the Lenovo-owned company had launched its last Moto X flagship in the form of the Moto X Style (seen above) back in July.