LG, which earlier this month said it faced no overheating problems for the Snapdragon 810 in the G Flex2, has now revealed that it encountered heating issues in the initial sample but was able to tackle it - though it remains unclear whether it received updated chipset, worked with Qualcomm to resolve the issue, or resolved the issue itself.
LG, besides changing its stance on the Snapdragon 810 from "quite satisfactory" earlier this month to "problems in the initial sample" for the Snapdragon 810, added that the LG G4 smartphone will arrive at its scheduled time. This does hint it will ship with the Snapdragon 810 SoC as well, but has yet to be confirmed. The information was revealed at LG press conference for its Q4 earnings, as per ZDNet Korea.
It is worth noting that the Qualcomm Snapdragon 810 overheating rumour emerged last month, when it was speculated that several flagship devices which were set to sport the SoC might reach the markets later than their scheduled time, as the OEMs would have to work on the issue and be double sure before the devices hit the shelves. Qualcomm rubbished those rumours, but that didn't stop further reports that Samsung would not be using the SoC.
Unlike LG, which has decided to go ahead with the Snapdragon 810, Samsung seems to playing safe with its Galaxy S6 flagship as the firm is said to be using its own octa-core Exynos 7420 processor with 14nm architecture. Qualcomm on Wednesday said that the chipset will not be powering the "flagship device" of a "large customer" this year. The company ahttps expected, did not mention the device-maker or the flagship device it would be missing from - though with all the past rumours, it is quite clear.
Nothing at this point is clear as a report this week added that Qualcomm has acknowledged the issue, and has a fix scheduled for the Galaxy S6. Previous reports had also tipped that Samsung would release the majority of Galaxy S6 smartphones with its own Exynos chipset, and a much smaller number with the Snapdragon 810.