Some details about the next mobile processors from Qualcomm due after the Snapdragon 810 have surfaced with a leaked roadmap of the chipmaker in 2015. The leak includes details about the successor to the Snapdragon 810, and the new Snapdragon 6xx series.
The Qualcomm Snapdragon 820, as per the roadmap, will feature an octa-core design with eight TS2 high-performance cores. The chipset however is tipped to release in the latter half of this year. This might mean that the anticipated Samsung Galaxy Note 5 might come powered by the processor. Some of the other features mentioned for the chip are Adreno 530 GPU, faster LPDDR4 RAM support, and an advanced MDM9X55 LTE-A Cat.10 Qualcomm modem.
Besides Snapdragon 820, Snapdragon 815 is another chipset that is seen in the roadmap shared by a Twitter tipster named @leaksfly (via Phonearena). Like the Snapdragon 820, the Snapdragon 815 is also hinted to feature an eight-core design but with four TS1 cores and four TS2 cores in a big.LITTLE configuration. While the RAM and modem stays the same as Snapdragon 820, the GPU downgrades to Adreno 450. The Snapdragon 815 is said to be made using a 20nm fabrication process, and not the 14nm FinFet process like the Snapdragon 820.
In the mid-range section, Qualcomm's yet-to-be-confirmed roadmap shows the Snapdragon 620, Snapdragon 625, and Snapdragon 629 SoCs. The Snapdragon 625 and Snapdragon 629 features an octa-core setup with Adreno 418 GPU, LPDDR4 RAM and MDM9X45 LTE-A Cat.10 modem. Both the chipsets are made using the 20nm HKMG Samsung/ GF process. It is not yet known if Qualcomm will use its custom cores or the ARM Cortex solution in these chips.
As for the Snapdragon 620, the chip is designed to include four cores, which are tipped to be Qualcomm Taipan cores clocked between 2GHz-2.5GHz. Other features include LPDDR3 RAM and the same GPU and modem as mentioned above for the other Snapdragon 6xx chips.
Lastly, the leak talks about the Qualcomm Snapdragon 616, which is said to be equipped with eight ARM Cortex-A53 cores, all clocked between 1.8GHz-2.2GHz, apart from Adreno 408 GPU, and LTE-A Cat. 6 modem. It is said to be made on a 28nm HKMG fabrication process by Shanghai-based Semiconductor Manufacturing International Company (SMIC).
Needless to say, Qualcomm is yet to confirm any of the aforementioned information. The firm has recently launched its Snapdragon 810 processor with LG G Flex2 at the CES event earlier this month. The chipset is likely to arrive in more number of flagship devices during the upcoming MWC 2015 set to happen from March 2 and March 5. Notably, a new Bloomberg report claims Samsung has decided not to use the Snapdragon 810 SoC on the Galaxy S6 due to overheating issues.