iPhone 5s teardown provides a look inside Apple's new phone

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iPhone 5s teardown provides a look inside Apple's new phone
Apple Inc's newest smartphone models hit stores on Friday in many countries across the world, including Australia and China. The gadget giant for the first time is selling a second smartphone dubbed "5c" featuring a plastic back and bright colors. The pricier "5s" now comes in three new colors - gray, silver and gold.

(Also see: Apple unveils iPhone 5c and iPhone 5s)

Technology firm iFixit disassembled a gold-colored iPhone and examined its parts. Following are some of the key components for the iPhone 5s (Review) and their makers that have been identified so far:

  • Chips from Avago, Skyworks Solutions are featured in the new iPhone. Companies supplying parts for the new phone also include memory chipmaker Hynix and radio-frequency chipmaker Triquint.
  • The new fingerprint sensor uses a chip from NXP Semiconductors.
  • There is no single M7 motion co-processor, a new chip that Apple said was part of the iPhone 5s when it unveiled the device last week. The M7 appears to be more a collection of chips, including chips for a gyroscope, accelerometer and compass, iFixit said.
  • Broadcom's BCM5976 chip is used for touchscreen controller. Murata Manufacturing Co's 339S0205 (based on the Broadcom BCM4334) is used in Wi-Fi module.
  • Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc.

(Also see: 10 new features in Apple's iPhone 5s)

Information is from iFixit, a Web site offering parts and self-repair guides for iPods and Macintosh computers. The company, which has conducted similar "tear downs" on other Apple products, posted step-by-step photos of the process on its Website.

© Thomson Reuters 2013

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