US-based Apple is ordering its higher-resolution liquid crystal display screens from Japanese electronics giant Sharp, Japan Display and South Korea's LG Display, it added. Taiwan's Commercial Times reported earlier this month that Taiwan Semiconductor Manufacturing Co. has started producing chips for Apple's next iPhone.
Previous leaks have said the iPhone 6 will arrive with a much thinner body, a powerful processor and a higher pixel density screen. As for the processor, both Samsung and TSMC are rumoured to be making the new A-series 'Apple A8' chips for the iPhone 6, separately rumoured to be clocked at 2.6GHz.
The iPhone 6 is also speculated to ship with an Ultra-Retina display, with a pixel density of 389ppi. This round of rumoured features came courtesy Sonny Dickson, the Australian teen who rose to fame in the build up to the release of iPhone 5s with what turned out to be largely accurate leaks.
Dickson, in one of his four tweets on the subject, also said, "iPhone 6 will be 0.22 inches thick #JustSaying." Other expected features include a bezel-less display, and a larger 8-megapixel camera with aperture size of f/2.0, as compared to the iPhone 5's f/2.4 and iPhone 5s' f/2.2.
Written with inputs from AFP