Apple Inc's newest smartphone models hit stores on Friday in many
countries across the world, including Australia and China. The gadget
giant for the first time is selling a second smartphone dubbed "5c"
featuring a plastic back and bright colors. The pricier "5s" now comes
in three new colors - gray, silver and gold.
(Also see: Apple unveils iPhone 5c and iPhone 5s)
Technology firm iFixit
disassembled a gold-colored iPhone and examined its parts. Following are
some of the key components for the iPhone 5s (Review) and their makers that have
been identified so far:
- Chips from Avago, Skyworks Solutions are
featured in the new iPhone. Companies supplying parts for the new phone
also include memory chipmaker Hynix and radio-frequency chipmaker
- The new fingerprint sensor uses a chip from NXP Semiconductors.
is no single M7 motion co-processor, a new chip that Apple said was
part of the iPhone 5s when it unveiled the device last week. The M7
appears to be more a collection of chips, including chips for a
gyroscope, accelerometer and compass, iFixit said.
BCM5976 chip is used for touchscreen controller. Murata Manufacturing
Co's 339S0205 (based on the Broadcom BCM4334) is used in Wi-Fi module.
- Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc.
(Also see: 10 new features in Apple's iPhone 5s)
is from iFixit, a Web site offering parts and self-repair guides for
iPods and Macintosh computers. The company, which has conducted similar
"tear downs" on other Apple products, posted step-by-step photos of the
process on its Website.
© Thomson Reuters 2013
iPhone 5c and iPhone 5s launch in pictures